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	<title>LSP Technologies</title>
	<link>http://lsptechnologies.com</link>
	<description>Making the world a safer place</description>
	<lastBuildDate>Sun, 27 Jun 2010 00:47:00 +0000</lastBuildDate>
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		<title>2010 Award for Excellence</title>
		<description><![CDATA[LSP Technologies, Inc. has been named a co-recipient of the 2010 Award for Excellence in Technology Transfer by the Department of Energy’s Federal Laboratory Consortium (FLC). LSP Technologies was recognized for their contribution toward transferring “Laser Shock Peening for Pilger Dies” to the commercial marketplace in collaboration with Battelle’s Pacific Northwest Laboratory (PNNL) and Sandvik [...]]]></description>
		<link>http://lsptechnologies.com/2010-award-for-excellence/585/</link>
			</item>
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		<title>DMC 2010</title>
		<description><![CDATA[LSP Technologies, Inc. will be exhibiting at the DMC Technology Forum. We hope to see you at our booth number 909. David Lahrman,  Jeff Dulaney, Peter Gaydos, and Richard Tenaglia will be available for discussion. 
November 29 &#8211; December 2, 2010
The Venetian, Las Vegas, Nevada
Booth Number 909

The DMC is the flagship defense manufacturing technology forum for [...]]]></description>
		<link>http://lsptechnologies.com/dmc-2010/436/</link>
			</item>
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		<title>TETS 2010</title>
		<description><![CDATA[LSP Technologies, Inc. will be exhibiting at theTurbine Engine Technology Symposium. We hope to see you at our booth.
David Lahrman, Peter Gaydos, and Richard Tenaglia will be available for discussion. 
September 13-16, 2010
Dayton Convention Center
Booth Number 126


The 2010 Turbine Engine Technology Symposium is the only forum where the United States’ turbine engine community gathers to [...]]]></description>
		<link>http://lsptechnologies.com/tets-2010/441/</link>
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		<title>LSP Technologies files patent-infringement suit against MIC</title>
		<description><![CDATA[On June 8, 2010, LSP Technologies, Inc. filed suit against Metal Improvement Company (MIC) for patent infringement.  The suit was filed in federal court in the southern district of Ohio.  The patent in suit is patent number 6,373,876 and is specifically related to laser peening system technology.
]]></description>
		<link>http://lsptechnologies.com/lsp-technologies-files-patent-infringement-suit-against-mic/629/</link>
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		<title>LSP Conference 2010</title>
		<description><![CDATA[LSP Technologies, Inc. will be presenting at the 2nd International Conference on Laser Peening. Three of our executives will be presenting, as listed below. 


 
The conference is specifically designed to bring together the most relevant scientists/specialists from all over the world. This conference will enable them to exchange their knowledge and to discuss and [...]]]></description>
		<link>http://lsptechnologies.com/laser-peening-conference-2010/464/</link>
			</item>
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		<title>AA&amp;S Conference 2010</title>
		<description><![CDATA[LSP Technologies, Inc. will be exhibiting at the Aircraft Airworthinness &#38; Sustainment Conference. We hope to see you at our booth number 409.
David Lahrman, Pete Gaydos, and Rich Tenaglia will be available for discussion. 
May 10-13, 2010
Austin Conference Center
Booth Number 409

The conference is designed to be of interest to DOD, NASA, FAA and industry professionals. [...]]]></description>
		<link>http://lsptechnologies.com/aa-s-conference-2010/428/</link>
			</item>
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		<title>Aviation Week MRO 2010</title>
		<description><![CDATA[LSP Technologies will be exhibiting at the upcoming Aviation Week MRO Show. We hope you will visit us at booth number 839.
David Lahrman and Pete Gaydos will be available for discussion.
April 20-21, 2010
Phoenix Convention Center
Booth Number 839
Join the most senior military leaders responsible for support of the DoD&#8217;s weapon systems as they join in strategic planning [...]]]></description>
		<link>http://lsptechnologies.com/aviation-week-mro-2010/420/</link>
			</item>
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		<title>LSP Technologies files patent-infringement suit</title>
		<description><![CDATA[On January 14, 2008, LSP Technologies, Inc. filed suit against Continuum Electro-Optics, Inc. for infringement of two of its patents: 5,127,019 and 6,191,385. The suit was filed in federal court in the southern district of Ohio. After initial discovery, a third patent (6,373,876) was added to the suit in November 2008.  All three patents are [...]]]></description>
		<link>http://lsptechnologies.com/lsp-technologies-files-patent-infringement-suit/399/</link>
			</item>
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		<title>Mobile Laser Bond Inspection System Demonstraion</title>
		<description><![CDATA[On November 10, 2009 LSP Technologies successfully demonstrated to the USAF the mobile laser bond inspection system that was constructed on two USAF SBIR (small business innovative research) programs.  This advanced pulsed laser inspection system is configured in a self-contained, environmentally-controlled enclosure that sits on a mobile platform.  This advancement is essential for rapid insertion [...]]]></description>
		<link>http://lsptechnologies.com/mobile-laser-bond-inspection-system-demonstraion/394/</link>
			</item>
	<item>
		<title>2008 TechColumbus Innovation Awards</title>
		<description><![CDATA[Finalists Announced for TechColumbus Innovation Awards
On Thursday, February 5, 2009 the 2008 TechColumbus Innovation Awards will recognize outstanding achievements in technology leadership and innovation at the Greater Columbus Convention Center.  From a record number of entries from individuals and companies in all disciplines and industries, 13 winners will be honored and the region&#8217;s progress as [...]]]></description>
		<link>http://lsptechnologies.com/2008-techcolumbus-innovation-awards/391/</link>
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