<?xml version="1.0" encoding="UTF-8"?>
<rss version="2.0"
	xmlns:content="http://purl.org/rss/1.0/modules/content/"
	xmlns:wfw="http://wellformedweb.org/CommentAPI/"
	xmlns:dc="http://purl.org/dc/elements/1.1/"
	xmlns:atom="http://www.w3.org/2005/Atom"
	xmlns:sy="http://purl.org/rss/1.0/modules/syndication/"
	xmlns:slash="http://purl.org/rss/1.0/modules/slash/"
	>

<channel>
	<title>LSP Technologies</title>
	<atom:link href="http://lsptechnologies.com/feed/" rel="self" type="application/rss+xml" />
	<link>http://lsptechnologies.com</link>
	<description>Making the world a safer place</description>
	<lastBuildDate>Sun, 27 Jun 2010 00:47:00 +0000</lastBuildDate>
	<generator>http://wordpress.org/?v=2.9.2</generator>
	<language>en</language>
	<sy:updatePeriod>hourly</sy:updatePeriod>
	<sy:updateFrequency>1</sy:updateFrequency>
			<item>
		<title>2010 Award for Excellence</title>
		<link>http://lsptechnologies.com/2010-award-for-excellence/585/</link>
		<comments>http://lsptechnologies.com/2010-award-for-excellence/585/#comments</comments>
		<pubDate>Sun, 27 Jun 2010 00:47:00 +0000</pubDate>
		<dc:creator>Beth</dc:creator>
				<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Laser Peening Applications]]></category>
		<category><![CDATA[David F Lahrman]]></category>
		<category><![CDATA[dies]]></category>
		<category><![CDATA[Laser Shock Processing]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Pilger Dies]]></category>
		<category><![CDATA[PNNL]]></category>
		<category><![CDATA[Sandvik]]></category>
		<category><![CDATA[Sandvik Special Metals]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=585</guid>
		<description><![CDATA[LSP Technologies, Inc. has been named a co-recipient of the 2010 Award for Excellence in Technology Transfer by the Department of Energy’s Federal Laboratory Consortium (FLC). LSP Technologies was recognized for their contribution toward transferring “Laser Shock Peening for Pilger Dies” to the commercial marketplace in collaboration with Battelle’s Pacific Northwest Laboratory (PNNL) and Sandvik [...]]]></description>
			<content:encoded><![CDATA[<p></p><p style="text-align: justify;">LSP Technologies, Inc. has been named a co-recipient of the 2010 Award for Excellence in Technology Transfer by the Department of Energy’s Federal Laboratory Consortium (FLC). LSP Technologies was recognized for their contribution toward transferring “Laser Shock Peening for Pilger Dies” to the commercial marketplace in collaboration with Battelle’s Pacific Northwest Laboratory (PNNL) and Sandvik Special Metals (SSM).  LSP Technologies pioneered the commercial development of a metal surface treatment called laser shock peening in the late 1990s, which was first invented in the 1970s by Battelle researchers in Columbus, Ohio.</p>
<p style="text-align: justify;">Special metalforming tools called pilger dies are used to reduce the circumference and wall thickness of metal tubes. The high operational stresses exerted on the dies during the cold pilgering process can result in frequent die failures, which results in costly downtime.   LSP Technologies, PNNL, and Sandvik teamed to develop and apply laser shock peening techniques to extend steel die life.  Dies treated by LSP Technologies can last up to six times longer than untreated dies. Laser shock peening deters die failures by using high-energy laser pulses to create deep, compressive residual stresses in the die&#8217;s surface.  LSP Technologies, Sandvik, and PNNL researchers are studying how the automotive, aerospace, and nuclear industries can benefit from this development. To read more about Laser Shock Peening of Pilger Dies, please click on the following link:<br />
<a href="http://lsptechnologies.com/wp-content/uploads/2010/06/LSP-of-Pilger-Dies-PNNL-Sandvik-LSPT.pdf">LSP of Pilger Dies &#8211; PNNL Sandvik LSPT</a></p>
]]></content:encoded>
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		<item>
		<title>DMC 2010</title>
		<link>http://lsptechnologies.com/dmc-2010/436/</link>
		<comments>http://lsptechnologies.com/dmc-2010/436/#comments</comments>
		<pubDate>Sat, 26 Jun 2010 15:13:55 +0000</pubDate>
		<dc:creator>Beth</dc:creator>
				<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Trade Shows and Conferences]]></category>
		<category><![CDATA[David F Lahrman]]></category>
		<category><![CDATA[Defense Manufacturing Conference]]></category>
		<category><![CDATA[DMC Forum]]></category>
		<category><![CDATA[Dr. Jeff L Dulaney]]></category>
		<category><![CDATA[Peter Gaydos]]></category>
		<category><![CDATA[Richard D Tenaglia]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=436</guid>
		<description><![CDATA[LSP Technologies, Inc. will be exhibiting at the DMC Technology Forum. We hope to see you at our booth number 909. David Lahrman,  Jeff Dulaney, Peter Gaydos, and Richard Tenaglia will be available for discussion. 
November 29 &#8211; December 2, 2010
The Venetian, Las Vegas, Nevada
Booth Number 909

The DMC is the flagship defense manufacturing technology forum for [...]]]></description>
			<content:encoded><![CDATA[<p></p><p><strong>LSP Technologies, Inc. will be exhibiting at the DMC Technology Forum. We hope to see you at our booth number 909.</strong> <strong>David Lahrman,  Jeff Dulaney, Peter Gaydos, and Richard Tenaglia will be available for discussion. </strong></p>
<p>November 29 &#8211; December 2, 2010<br />
The Venetian, Las Vegas, Nevada<br />
Booth Number 909</p>
<p style="text-align: center;"><a href="http://www.dmc2010.com/"><img class="size-full wp-image-487   aligncenter" src="http://lsptechnologies.com/wp-content/uploads/2010/03/DMC-2010-logo2.jpg" alt="" width="173" height="80" /></a></p>
<p>The DMC is the flagship defense manufacturing technology forum for exchanging ideas, assessing technical project progress and dealing with the challenges of the many new and traditional defense industrial base issues across the services and agencies.</p>
<p><a href="http://www.dmc2010.com/">http://www.dmc2010.com/</a></p>
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		</item>
		<item>
		<title>TETS 2010</title>
		<link>http://lsptechnologies.com/tets-2010/441/</link>
		<comments>http://lsptechnologies.com/tets-2010/441/#comments</comments>
		<pubDate>Sat, 26 Jun 2010 14:48:34 +0000</pubDate>
		<dc:creator>Beth</dc:creator>
				<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Trade Shows and Conferences]]></category>
		<category><![CDATA[David F Lahrman]]></category>
		<category><![CDATA[Gas Turbine Engine]]></category>
		<category><![CDATA[Peter Gaydos]]></category>
		<category><![CDATA[Richard D Tenaglia]]></category>
		<category><![CDATA[Turbine Engine Symposium]]></category>
		<category><![CDATA[Turbine Engine Technology Symposium]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=441</guid>
		<description><![CDATA[LSP Technologies, Inc. will be exhibiting at theTurbine Engine Technology Symposium. We hope to see you at our booth.
David Lahrman, Peter Gaydos, and Richard Tenaglia will be available for discussion. 
September 13-16, 2010
Dayton Convention Center
Booth Number 126


The 2010 Turbine Engine Technology Symposium is the only forum where the United States’ turbine engine community gathers to [...]]]></description>
			<content:encoded><![CDATA[<p></p><p><strong>LSP Technologies, Inc. will be exhibiting at theTurbine Engine Technology Symposium. We hope to see you at our booth.</strong><br />
<strong>David Lahrman, Peter Gaydos, and Richard Tenaglia will be available for discussion. </strong></p>
<p><strong>September 13-16, 2010<br />
</strong>Dayton Convention Center<br />
Booth Number 126</p>
<p style="text-align: center;"><a href="http://www.tets.utcdayton.com/"><img class="size-full wp-image-475 aligncenter" src="http://lsptechnologies.com/wp-content/uploads/2010/03/TETS-logo2.jpg" alt="" width="302" height="74" /></a></p>
<p><a href="http://lsptechnologies.com/wp-content/uploads/2010/03/TETS-logo1.jpg"></a></p>
<p>The 2010 Turbine Engine Technology Symposium is the only forum where the United States’ turbine engine community gathers to review and discuss the latest technology advances achieved through the Versatile, Affordable, Advanced Turbine Engines (VAATE) Program.</p>
<p><a href="http://www.tets.utcdayton.com/">http://www.tets.utcdayton.com/</a></p>
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		<item>
		<title>LSP Technologies files patent-infringement suit against MIC</title>
		<link>http://lsptechnologies.com/lsp-technologies-files-patent-infringement-suit-against-mic/629/</link>
		<comments>http://lsptechnologies.com/lsp-technologies-files-patent-infringement-suit-against-mic/629/#comments</comments>
		<pubDate>Thu, 10 Jun 2010 01:31:34 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Intellectual Property]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Metal Improvement Company]]></category>
		<category><![CDATA[Patent]]></category>
		<category><![CDATA[Patent Infringement]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=629</guid>
		<description><![CDATA[On June 8, 2010, LSP Technologies, Inc. filed suit against Metal Improvement Company (MIC) for patent infringement.  The suit was filed in federal court in the southern district of Ohio.  The patent in suit is patent number 6,373,876 and is specifically related to laser peening system technology.
]]></description>
			<content:encoded><![CDATA[<p></p><p>On June 8, 2010, LSP Technologies, Inc. filed suit against Metal Improvement Company (MIC) for patent infringement.  The suit was filed in federal court in the southern district of Ohio.  The patent in suit is patent number 6,373,876 and is specifically related to laser peening system technology.</p>
]]></content:encoded>
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		</item>
		<item>
		<title>LSP Conference 2010</title>
		<link>http://lsptechnologies.com/laser-peening-conference-2010/464/</link>
		<comments>http://lsptechnologies.com/laser-peening-conference-2010/464/#comments</comments>
		<pubDate>Mon, 08 Mar 2010 02:42:18 +0000</pubDate>
		<dc:creator>Beth</dc:creator>
				<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Trade Shows and Conferences]]></category>
		<category><![CDATA[Dr. Allan H Clauer]]></category>
		<category><![CDATA[Dr. Jeff L Dulaney]]></category>
		<category><![CDATA[Richard D Tenaglia]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=464</guid>
		<description><![CDATA[LSP Technologies, Inc. will be presenting at the 2nd International Conference on Laser Peening. Three of our executives will be presenting, as listed below. 


 
The conference is specifically designed to bring together the most relevant scientists/specialists from all over the world. This conference will enable them to exchange their knowledge and to discuss and [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>LSP Technologies, Inc. will be presenting at the 2<sup>nd</sup> International Conference on Laser Peening. Three of our executives will be presenting, as listed below. </em></strong></p>
<p><a href="http://www.laserpeening.utcdayton.com/"></p>
<p style="text-align: center;"><img class="size-full wp-image-478 aligncenter" src="http://lsptechnologies.com/wp-content/uploads/2010/03/2nd-Peening-Conf1.jpg" alt="" width="446" height="110" /></p>
<p> </em></strong></a><br />
The conference is specifically designed to bring together the most relevant scientists/specialists from all over the world. This conference will enable them to exchange their knowledge and to discuss and cooperate on recent state-of-the-art innovative technologies related to Laser Peening/Laser Shock Processing, along with the latest developments and implementations in the industrial applications of laser peening. The scope of the conference will be dedicated not only to the academic or industrial community working on laser-peening systems or applications, but also to all those working on surface modification technologies or structural integrity interested by the emergence of this process.</p>
<p><strong>Monday, April 19, 9:40 AM<br />
&#8220;Advances in Modeling of Laser Peening for Carburized Steels&#8221;<br />
Mr. Richard D. Tenaglia</strong><br />
Laser peening is being evaluated by the U.S. Army to toughen helicopter gears, transmission components, and other rotorcraft structural parts.  A critical need exists to boost engine power, particularly when operating in high altitude environments.  Laser peening offers the potential to increase the fatigue performance or damage tolerance of these components without increasing the size or the weight of the propulsion system.</p>
<p>Computer simulation is essential for reducing the development time and costs for optimizing the use of laser peening of actual components.  Modeling of advanced carburized gear steels presents unique challenges.  The composition and hardness gradients in the surface of the carburized steel parts cause gradients of mechanical and physical properties, which affect the laser peen processing response.  To simulate the response properly, it is important to carry the residual stress state from heat treatment forward into the laser shock peening models to predict the resulting compressive residual surface stress profiles, and then transition these profiles to the final part loading models for performance prediction.</p>
<p>This paper presents the recent results of modeling and experimental validation efforts to simulate laser peening of carburized steels, with a correlation of residual stress profiles to fatigue performance.</p>
<p><strong>Monday, April 19, 2:10 PM<br />
&#8220;Production Laser Peening Using Automated Overlay Applicators&#8221;<br />
Dr. Jeff L. Dulaney</strong><br />
Over the past three years, LSP Technologies has developed an automated overlay applicator system suitable for production laser peening.  This automated system increases throughput and decreases production cost by eliminating manual operations typically associated with tape overlays.  The automated overlay applicators are interfaced with the laser and parts positioning equipment to create a smooth production operation.  The part moves into position, the liquid opaque overlay is applied, the transparent water overlay is applied, the laser fires, and a blast of air preps the surface for the next automated sequence.  The sequence is repeated at the repetition rate of the laser system until processing is completed.</p>
<p>This technology represents an important breakthrough in how laser peening will be implemented in the future: no more expensive, labor-intensive manual applications of tape or similar opaque overlays.  We have successfully introduced automated overlay applicator technology into our production operations, using it to process thousands of parts across two different market sectors: gas turbine engines and tooling dies. </p>
<p>In this presentation, the author will discuss the operation of the automated overlay applicator system, critical elements of its operation, and how it transitioned from development to production.  The presentation will include photographs of hardware and an operational video showing the system in action.<span id="_marker"> </span></p>
<p><strong>Tuesday, April 20, 8:00 AM<br />
&#8220;Fretting Fatigue of Laser Peened Ti-6A1-4V&#8221;<br />
Dr. Allan H. Clauer</strong><br />
Fretting fatigue tests of laser peened Ti-6Al-4V were performed. The laser peening conditions included use of large, 5.6 mm diameter, and small, 1 mm diameter spots. Both produced significant increases in fatigue life. Depending on the fatigue loading conditions, fatigue life was increased from 10 to greater than 25 times, with most of the laser peened specimens running out at 10<sup>6</sup> cycles. Increasing the bulk fatigue loads to produce failures was limited by the capacity of the fatigue testing machinery.  The fretting fatigue cracks observed in the laser peened material, appear to be similar to those formed in non-laser peened Ti-6Al-4V, presumably because the contact stresses dominate the laser peening induced compressive residual stresses at the fretting surface. However, the laser peening compressive residual stress inhibited their evolution into propagating fatigue cracks. The small laser spot patterns produced a rough surface compared to the large spots, and showed a much different fretting behavior. However both spot sizes produced comparable fatigue life increases.  Metallographic examinations of the fretting surfaces and fretting cracks produced within the fatigue bars and the fretting pads by different fretting and laser peening conditions will be presented and discussed.</p>
<p> This investigation demonstrates that laser peening produces a significant life increase in Ti-6Al-4V under fretting fatigue conditions. It also shows that small spots can produce comparable life increases to large spots even though the fretting situation differs due to the rougher surface produced by the small spots.<br />
<strong><em> </em></strong></p>
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		<title>AA&amp;S Conference 2010</title>
		<link>http://lsptechnologies.com/aa-s-conference-2010/428/</link>
		<comments>http://lsptechnologies.com/aa-s-conference-2010/428/#comments</comments>
		<pubDate>Thu, 04 Mar 2010 16:56:29 +0000</pubDate>
		<dc:creator>Beth</dc:creator>
				<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Trade Shows and Conferences]]></category>
		<category><![CDATA[David F Lahrman]]></category>
		<category><![CDATA[Pete Gaydos]]></category>
		<category><![CDATA[Richard D Tenaglia]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=428</guid>
		<description><![CDATA[LSP Technologies, Inc. will be exhibiting at the Aircraft Airworthinness &#38; Sustainment Conference. We hope to see you at our booth number 409.
David Lahrman, Pete Gaydos, and Rich Tenaglia will be available for discussion. 
May 10-13, 2010
Austin Conference Center
Booth Number 409

The conference is designed to be of interest to DOD, NASA, FAA and industry professionals. [...]]]></description>
			<content:encoded><![CDATA[<p></p><p><strong>LSP Technologies, Inc. will be exhibiting at the Aircraft Airworthinness &amp; Sustainment Conference. We hope to see you at our booth number 409.</strong><br />
<strong>David Lahrman, Pete Gaydos, and Rich Tenaglia will be available for discussion. </strong></p>
<p><strong>May 10-13, 2010<br />
</strong>Austin Conference Center<br />
Booth Number 409</p>
<p><a href="http://lsptechnologies.com/wp-content/uploads/2010/03/AAS-Logo.jpg"><img class="alignleft size-medium wp-image-427" src="http://lsptechnologies.com/wp-content/uploads/2010/03/AAS-Logo-300x83.jpg" alt="" width="271" height="79" /></a></p>
<p>The conference is designed to be of interest to DOD, NASA, FAA and industry professionals. It is an excellent forum for sharing ideas and developing new efforts to address airworthiness and sustainment issues facing the community. Hopefully, every attendee will be able to take advantage of the wide variety of research, training and technology made available during the conference. We look forward to seeing you in Austin.</p>
<p><a href="http://www.airworthiness2010.com/">http://www.airworthiness2010.com/</a></p>
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		<title>Aviation Week MRO 2010</title>
		<link>http://lsptechnologies.com/aviation-week-mro-2010/420/</link>
		<comments>http://lsptechnologies.com/aviation-week-mro-2010/420/#comments</comments>
		<pubDate>Thu, 04 Mar 2010 16:15:43 +0000</pubDate>
		<dc:creator>Beth</dc:creator>
				<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Trade Shows and Conferences]]></category>
		<category><![CDATA[Aviation Week]]></category>
		<category><![CDATA[David F Lahrman]]></category>
		<category><![CDATA[Pete Gaydos]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=420</guid>
		<description><![CDATA[LSP Technologies will be exhibiting at the upcoming Aviation Week MRO Show. We hope you will visit us at booth number 839.
David Lahrman and Pete Gaydos will be available for discussion.
April 20-21, 2010
Phoenix Convention Center
Booth Number 839
Join the most senior military leaders responsible for support of the DoD&#8217;s weapon systems as they join in strategic planning [...]]]></description>
			<content:encoded><![CDATA[<p></p><p><strong>LSP Technologies will be exhibiting at the upcoming Aviation Week MRO Show. We hope you will visit us at booth number 839.</strong><br />
<strong>David Lahrman and Pete Gaydos will be available for discussion.</strong></p>
<p><strong>April 20-21, 2010<br />
</strong>Phoenix Convention Center<br />
Booth Number 839</p>
<p><a href="http://lsptechnologies.com/wp-content/uploads/2010/03/Aviation-Week-MRO-logo1.jpg"></a><a href="http://lsptechnologies.com/wp-content/uploads/2010/03/Aviation-Week-MRO-logo2.jpg"><img class="alignleft size-full wp-image-451" src="http://lsptechnologies.com/wp-content/uploads/2010/03/Aviation-Week-MRO-logo2.jpg" alt="" width="117" height="100" /></a>Join the most senior military leaders responsible for support of the DoD&#8217;s weapon systems as they join in strategic planning sessions to share best practices, lessons learned, and emerging ideas/technologies in the field of MRO. And don’t miss MRO exhibition! This is the one-stop-shop for military MRO.</p>
<p>• Find innovative tools for trimming cost and improving system availability, reliability, cost and cycle time</p>
<p>• Discover propulsion technology that will reduce fuel burn</p>
<p>• Get solutions for inventory control, capacity planning and future sustainment of ground and air weapons</p>
<p>• Develop domestic and international business contacts</p>
<p>• Benchmark best practices, products and services against the commercial sector</p>
<p><a href="http://www.aviationweek.com/events/current/mil/index.htm">http://www.aviationweek.com/events/current/mil/index.htm</a></p>
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		<title>LSP Technologies files patent-infringement suit</title>
		<link>http://lsptechnologies.com/lsp-technologies-files-patent-infringement-suit/399/</link>
		<comments>http://lsptechnologies.com/lsp-technologies-files-patent-infringement-suit/399/#comments</comments>
		<pubDate>Sat, 21 Nov 2009 23:07:43 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Intellectual Property]]></category>
		<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Continuum Electro-Optics]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Patent]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=399</guid>
		<description><![CDATA[On January 14, 2008, LSP Technologies, Inc. filed suit against Continuum Electro-Optics, Inc. for infringement of two of its patents: 5,127,019 and 6,191,385. The suit was filed in federal court in the southern district of Ohio. After initial discovery, a third patent (6,373,876) was added to the suit in November 2008.  All three patents are [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>On January 14, 2008, LSP Technologies, Inc. filed suit against Continuum Electro-Optics, Inc. for infringement of two of its patents: 5,127,019 and 6,191,385. The suit was filed in federal court in the southern district of Ohio. After initial discovery, a third patent (6,373,876) was added to the suit in November 2008.  All three patents are related to laser peening system technology.</p>
]]></content:encoded>
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		<title>Mobile Laser Bond Inspection System Demonstraion</title>
		<link>http://lsptechnologies.com/mobile-laser-bond-inspection-system-demonstraion/394/</link>
		<comments>http://lsptechnologies.com/mobile-laser-bond-inspection-system-demonstraion/394/#comments</comments>
		<pubDate>Tue, 17 Nov 2009 00:32:09 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[Boeing]]></category>
		<category><![CDATA[David F Lahrman]]></category>
		<category><![CDATA[General Electric Aviation]]></category>
		<category><![CDATA[High Energy Laser]]></category>
		<category><![CDATA[Laser Bond Inspection]]></category>
		<category><![CDATA[Steven M Toller]]></category>
		<category><![CDATA[USAF]]></category>
		<category><![CDATA[WPAFB]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=394</guid>
		<description><![CDATA[On November 10, 2009 LSP Technologies successfully demonstrated to the USAF the mobile laser bond inspection system that was constructed on two USAF SBIR (small business innovative research) programs.  This advanced pulsed laser inspection system is configured in a self-contained, environmentally-controlled enclosure that sits on a mobile platform.  This advancement is essential for rapid insertion [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>On November 10, 2009 LSP Technologies successfully demonstrated to the USAF the mobile laser bond inspection system that was constructed on two USAF SBIR (small business innovative research) programs.  This advanced pulsed laser inspection system is configured in a self-contained, environmentally-controlled enclosure that sits on a mobile platform.  This advancement is essential for rapid insertion of the LBI process into aircraft manufacturing plant operations and aircraft maintenance depots.  There exists no equivalent laser system in the commercial sector.</p>
<p>Laser Bond Inspection (LBI) is a local proof-testing method that applies a well-controlled dynamic stress to a composite structure, and senses the failure of weak laminate or weak adhesive bonds in response to the stress. The dynamic stress is generated by the interaction of a pulsed laser beam with a composite structure. The controlled stressing of the composite material has no effect on the material or bond if it is not damaged, defective, or substandard. The technique offers a practical structural health monitoring solution for locating composite damage and defect regions in laminate and laminate-adhesive bonds in aircraft.</p>
<p>Benefits of laser bond inspection include the following: </p>
<ul>
<li>Allows the detection of “kissing bonds” in composite structures that are not detectable by standard nondestructive inspection techniques</li>
<li>Makes calibrated dynamic strength measurements to find weak areas in composite laminate or adhesive bonds that conventional testing cannot locate</li>
<li>LBI may be applied to metal-to-composite and metal-to-metal bonds as well as pure composite assemblies</li>
<li>LBI can be applied for inspecting a variety of commercial,  reconnaissance, and targeting aircraft</li>
<li>LBI improves reliability and reduce maintenance cost of composite aircraft structures</li>
</ul>
<p>As program manager of the project, David W Sokol would like to thank Steve Toller, Jim Niehaus, Brad Lance, Rick Mills, and Kevin Romer for all their hard work on the program.  He would also like to thank David Lahrman for working with WPAFB staff in making this USAF SBIR program possible.</p>
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		<title>2008 TechColumbus Innovation Awards</title>
		<link>http://lsptechnologies.com/2008-techcolumbus-innovation-awards/391/</link>
		<comments>http://lsptechnologies.com/2008-techcolumbus-innovation-awards/391/#comments</comments>
		<pubDate>Fri, 30 Jan 2009 02:52:33 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Commmunity Recognition]]></category>
		<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Laser Bond Inspection]]></category>
		<category><![CDATA[LBI]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=391</guid>
		<description><![CDATA[Finalists Announced for TechColumbus Innovation Awards
On Thursday, February 5, 2009 the 2008 TechColumbus Innovation Awards will recognize outstanding achievements in technology leadership and innovation at the Greater Columbus Convention Center.  From a record number of entries from individuals and companies in all disciplines and industries, 13 winners will be honored and the region&#8217;s progress as [...]]]></description>
			<content:encoded><![CDATA[<p></p><p style="text-align: center;"><strong><em>Finalists Announced for TechColumbus Innovation Awards</em></strong></p>
<p>On Thursday, February 5, 2009 the 2008 TechColumbus Innovation Awards will recognize outstanding achievements in technology leadership and innovation at the Greater Columbus Convention Center.  From a record number of entries from individuals and companies in all disciplines and industries, 13 winners will be honored and the region&#8217;s progress as an emerging tech center will be celebrated.</p>
<p>LSP Technologies is proud to announce we are a finalist in the Outstanding Service (company with less than 50 employees/more than 50) category and was nominated for our Laser Bond Inspection system and its ability to inspect the integrity of bonded composite structures, an ability that is unmatched by any other technology.  It is an honor to be a finalist for this award and recognized for our innovations. We look forward to the event to be surrounded by our peers, colleagues and mentors.</p>
<p>The TechColumbus Innovations Awards celebrate and honor individuals and teams in a variety of disciplines. Each category is an important component of the technology and innovation community. Receiving the top honor showcases an individual or team which is dramatically impacting Central Ohio and beyond.  For more information about TechColumbus and the Innovation Awards, visit <a href="http://www.techcolumbusinnovationawards.org/">http://www.techcolumbusinnovationawards.org</a>.</p>
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