Laser peening also known as laser-peening or laser shock processing (LSP) increases the resistance of materials to surface-related failures such as, FOD, fatigue, fretting fatigue, and stress corrosion cracking. It does this by driving compressive residual stresses into metals and alloys.
Please stop by our booth, David Lahrman will be available for discussion about the benefits that laser peening surface enhancement technology can provide your parts to reduce their fatigue susceptibility. See the beneifts of laser peening on our FAQs page at http://lsptechnologies.com/questions/.
David Lahrman will also be available to discuss Laser Bond Inspection. It is LSP Technologies’ new NDE method to inspect adhesive bond joints in composites or other bonded materials. LBI uses a localized stress wave created by a laser beam of high peak power with a short pulse to create an internal disbond in weak bonds that is detectable by the laser bond inspection system itself or by a post test ultrasonic inspection.
LSP Technologies, Inc. will be exhibiting at DMC 2011. We hope you will visit us at booth number 628.
November 28 – December 1, 2011
Anaheim, California
Anaheim Convention Center
Booth Number: 628
The DMC is the flagship defense manufacturing technology forum for exchanging ideas, assessing technical project progress and dealing with the challenges of the many new and traditional defense industrial base issues across the services and agencies.