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	<title>LSP Technologies &#187; LSP Technologies</title>
	<atom:link href="http://lsptechnologies.com/category/lsp-technologies/feed/" rel="self" type="application/rss+xml" />
	<link>http://lsptechnologies.com</link>
	<description>Making the world a safer place</description>
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		<title>2012 Aircraft Airworthiness &amp; Sustainment Conference</title>
		<link>http://lsptechnologies.com/2012-aircraft-airworthiness-sustainment-conference/985/</link>
		<comments>http://lsptechnologies.com/2012-aircraft-airworthiness-sustainment-conference/985/#comments</comments>
		<pubDate>Mon, 13 Feb 2012 17:28:21 +0000</pubDate>
		<dc:creator>SED</dc:creator>
				<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Laser Peening Applications]]></category>
		<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[Surface Enhancement Technologies]]></category>
		<category><![CDATA[Trade Shows and Conferences]]></category>
		<category><![CDATA[David F Lahrman]]></category>
		<category><![CDATA[Fatigue Life]]></category>
		<category><![CDATA[Foreign Object Damage]]></category>
		<category><![CDATA[Gas Turbine Engine]]></category>
		<category><![CDATA[Laser Bond Inspection]]></category>
		<category><![CDATA[Laser Shock Processing]]></category>
		<category><![CDATA[surface enhancement]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=985</guid>
		<description><![CDATA[LSP Technologies Business Development Director, David Lahrman and Senior Metallurgical Engineer, Stan Bovid will be at the 2012 Aircraft Airworthiness &#38; Sustainment Conference in  Baltimore, Maryland on April 2 to 5.  Stop by our new booth and talk to them about laser peening or laser bond inspection, two innovative laser technologies of which LSP Technologies [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>LSP Technologies Business Development Director, David Lahrman and Senior Metallurgical Engineer, Stan Bovid will be at the 2012 Aircraft Airworthiness &amp; Sustainment Conference in  Baltimore, Maryland on April 2 to 5.  Stop by our new booth and talk to them about laser peening or laser bond inspection, two innovative laser technologies of which LSP Technologies is in the forefront.</p>
<p>This conference provides the opportunity to discuss the safety and sustainment issues of legacy fleets, the airworthiness issues of future aircraft and the transition between the old and new fleets.</p>
<p>Visit the conference website for more information about the event… <a title="2012 Aircraft Airworthiness &amp; Sustainment Conference " href="http://www.airworthiness2012.com/index.html">http://www.airworthiness2012.com/index.html</a></p>
<p>&nbsp;</p>
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		<item>
		<title>Patent Infringement Lawsuit Update</title>
		<link>http://lsptechnologies.com/patent-infringement-lawsuit-update-2/979/</link>
		<comments>http://lsptechnologies.com/patent-infringement-lawsuit-update-2/979/#comments</comments>
		<pubDate>Sun, 12 Feb 2012 01:18:50 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Intellectual Property]]></category>
		<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Laser Shock Processing]]></category>
		<category><![CDATA[Metal Improvement Company]]></category>
		<category><![CDATA[MIC]]></category>
		<category><![CDATA[Patent]]></category>
		<category><![CDATA[Patent Infringement]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=979</guid>
		<description><![CDATA[On May 11, 2011 MIC filed a second Request for Reexamination with the USPTO, again asking that the USPTO reexamine all of the claims of the &#8217;876 patent in light of various printed publications and affidavits submitted by MIC in the second Request. As expected, on January 17, 2012, the USPTO issued a Notice of [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>On May 11, 2011 MIC filed a second Request for Reexamination with the USPTO, again asking that the USPTO reexamine all of the claims of the &#8217;876 patent in light of various printed publications and affidavits submitted by MIC in the second Request.  As expected, on January 17, 2012, the USPTO issued a Notice of Intent to Issue a Reexamination Certificate, wherein the USPTO once again stated its intent to confirm all 38 of the claims of the &#8217;876 patent in their originally issued form.  As a result, all of the originally issued claims of the &#8217;876 patent remain valid and enforceable.</p>
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		<item>
		<title>Patent Infringement Lawsuit Update</title>
		<link>http://lsptechnologies.com/patent-infringement-lawsuit-update/967/</link>
		<comments>http://lsptechnologies.com/patent-infringement-lawsuit-update/967/#comments</comments>
		<pubDate>Tue, 27 Sep 2011 14:45:36 +0000</pubDate>
		<dc:creator>SED</dc:creator>
				<category><![CDATA[Intellectual Property]]></category>
		<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Laser Shock Processing]]></category>
		<category><![CDATA[laserpeening]]></category>
		<category><![CDATA[LSP]]></category>
		<category><![CDATA[Metal Improvement Company]]></category>
		<category><![CDATA[Patent Infringement]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=967</guid>
		<description><![CDATA[  On June 8, 2010, LSPT filed a patent infringement lawsuit against Metal Improvement Company, LLC (&#8220;MIC&#8221;) in the U.S. District Court for the Southern District of Ohio, Eastern Division, alleging infringement of U.S. Patent No. 6,373,876 (the &#8220;&#8217;876 patent&#8221;).  On September 3, 2010, MIC filed a Request for Reexamination with the U.S. Patent and Trademark [...]]]></description>
			<content:encoded><![CDATA[<p></p><p> </p>
<p>On June 8, 2010, LSPT filed a patent infringement lawsuit against Metal Improvement Company, LLC (&#8220;MIC&#8221;) in the U.S. District Court for the Southern District of Ohio, Eastern Division, alleging infringement of U.S. Patent No. 6,373,876 (the &#8220;&#8217;876 patent&#8221;).  On September 3, 2010, MIC filed a Request for Reexamination with the U.S. Patent and Trademark Office (&#8220;USPTO&#8221;), asking that the USPTO reexamine the claims of the &#8217;876 patent in light of various printed publications submitted by MIC in the Request.  The Court stayed the lawsuit pending the outcome of the reexamination proceeding.  On March 25, 2011, the USPTO issued a Notice of Intent to Issue a Reexamination Certificate, wherein the USPTO stated its intent to confirm all 38 of the claims of the &#8217;876 patent.  On July 5, 2011, the USPTO issued a Reexamination Certificate, <a href="file://lsptdc00/LSPTshares/Marketing/Web%20Site/Web%20site%20link%20documents/Ex%20Parte%20Reexamination%20Certificate%20No.%20US%206,373,876%20C1.pdf" target="_blank">Ex Parte Reexamination Certificate No. US 6,373,876 C1</a>, declaring:  &#8220;As a result of the reexamination, it has been determined that:  The patentability of claims 1-38 is confirmed.&#8221;  As a result, all of the claims of the &#8217;876 patent remain valid and enforceable.</p>
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		<item>
		<title>Brochure</title>
		<link>http://lsptechnologies.com/brochure/591/</link>
		<comments>http://lsptechnologies.com/brochure/591/#comments</comments>
		<pubDate>Mon, 01 Aug 2011 13:48:18 +0000</pubDate>
		<dc:creator>Beth</dc:creator>
				<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Laser Peening Applications]]></category>
		<category><![CDATA[LBI Publications]]></category>
		<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Shot Peening Alternative]]></category>
		<category><![CDATA[Surface Enhancement Technologies]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=591</guid>
		<description><![CDATA[LSP Technologies offers affordable laser peening services to improve the fatigue properties of our customer&#8217;s military, aerospace, power generation, tube forming, or other types of parts.  We collaborate with our customers to enhance their products with this innovative laser technology by increasing reliability, improving safety, and adding value.  We also provide an innovative non-destructive method [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>LSP Technologies offers affordable laser peening services to improve the fatigue properties of our customer&#8217;s military, aerospace, power generation, tube forming, or other types of parts.  We collaborate with our customers to enhance their products with this innovative laser technology by increasing reliability, improving safety, and adding value.  We also provide an innovative non-destructive method of inspecting glue bonds in metals and/or composties that can detect &#8220;kissing bonds&#8221;. </p>
<p>For a better picture of our capabilities follow the link below to one of our marketing brochures.  </p>
<p><a href="http://lsptechnologies.com/wp-content/uploads/2010/05/LSP-Trifold.pdf">LSP Trifold</a></p>
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		<title>LSP Technologies Awarded Laser Bond Inspection Improvements Contract</title>
		<link>http://lsptechnologies.com/lsp-technologies-awarded-laser-bond-inspection-improvements-contract/954/</link>
		<comments>http://lsptechnologies.com/lsp-technologies-awarded-laser-bond-inspection-improvements-contract/954/#comments</comments>
		<pubDate>Mon, 01 Aug 2011 13:23:48 +0000</pubDate>
		<dc:creator>SED</dc:creator>
				<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[LSP Technologies]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=954</guid>
		<description><![CDATA[LSP Technologies’ proudly announces it has won a Task Order subcontracting award with Universal Technology Corporation (UTC) of Dayton, Ohio. UTC is the prime for the Air Force Research Laboratory’s Materials and Manufacturing Directorate, Manufacturing Technology Division (AFRL/RXM) contract for “Mobil Systems for Aircraft Structures”. This Task Order program supports LSP Technologies’ Laser Bond Inspection [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>LSP Technologies’ proudly announces it has won a Task Order subcontracting award with Universal Technology Corporation (UTC) of Dayton, Ohio. UTC is the prime for the Air Force Research Laboratory’s Materials and Manufacturing Directorate, Manufacturing Technology Division (AFRL/RXM) contract for “Mobil Systems for Aircraft Structures”.</p>
<p>This Task Order program supports LSP Technologies’ Laser Bond Inspection System for the inspection of bonded structures used in Aircraft structures. The objective of this MATES II T.O. program is to secure CDRH for the laser system and to develop additional capabilities for detecting defects in the bond line of bonded structures. The Laser Bond Inspection system will receive some improvements to ease customization for customers and make other updates and improvements. LSP Technologies will also conduct research under the contract to support the system growth. </p>
<p>Laser bond inspection technology (LBI) tests and verifies the strength of adhesively bonded joints used in composite structures within assemblies such as aircraft.  It is an inspection process that further assures the safety and reliability of those bonded structures. LBI technology is also being adapted for use with other bonded structures, including, for example, metals and ceramics, and metal to metal. It is an honor to be working with UTC on this important aspect for bridging the gap between military manufacturing needs and industry capabilities. For more information on LSP Technologies’ Laser Bond Inspection system and its capabilities, visit <a href="http://lsptechnologies.com/">http://lsptechnologies.com/</a>, or for more information about Universal Technology Corporation (UTC), visit <a href="http://www.utcdayton.com/">http://www.utcdayton.com/</a>.</p>
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		<title>Laser Peening topic at Shot Peening Conference</title>
		<link>http://lsptechnologies.com/laser-peening-topic-at-shot-peening-conference/948/</link>
		<comments>http://lsptechnologies.com/laser-peening-topic-at-shot-peening-conference/948/#comments</comments>
		<pubDate>Fri, 01 Jul 2011 16:46:09 +0000</pubDate>
		<dc:creator>SED</dc:creator>
				<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Laser Peening Applications]]></category>
		<category><![CDATA[Laser Peening Data]]></category>
		<category><![CDATA[Laser Peening Publications]]></category>
		<category><![CDATA[Low Plasticity Burnishing]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Shot Peening Alternative]]></category>
		<category><![CDATA[Surface Enhancement Technologies]]></category>
		<category><![CDATA[Trade Shows and Conferences]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=948</guid>
		<description><![CDATA[Mr. David Lahrman will present a paper he co-authored entitled, “The LaserPeen™ Process and Emerging Applications”  September 12-15, 2011 at the 11th International Conference on Shot Peening. ABSTRACT &#8220;Laser peening has been demonstrated as a unique and valuable method to increase the resistance of aircraft gas turbine engine compressor and fan blades to foreign object [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>Mr. David Lahrman will present a paper he co-authored entitled, “<strong>The LaserPeen™ Process and Emerging Applications</strong>”  September 12-15, 2011 at the 11th International Conference on Shot Peening.<br />
<strong>ABSTRACT</strong></p>
<p>&#8220;Laser peening has been demonstrated as a unique and valuable method to increase the resistance of aircraft gas turbine engine compressor and fan blades to foreign object damage (FOD) and improve high cycle fatigue (HCF) life.  Laser peening is also known as the LaserPeen<strong><sup>™</sup></strong> Process or laser shock processing (LSP).</p>
<p> Laser peening drives a high amplitude shock wave into a material surface using a high-energy laser pulse.  The plastic deformation caused by the shock wave results in deep compressive residual stresses in the surface of the part.  The depth and magnitude of the residual stresses depend upon the material and the processing parameters.  Compressive residual stresses typically extend as deep as 0.040-0.060 inches (1.0 to 1.5 mm) below the surface and can approach the yield strength of the material.  These compressive residual stresses increase the resistance of materials to surface-related failures such as fatigue, fretting fatigue, and stress corrosion cracking.</p>
<p> The successful use of laser peening on aircraft turbine engines blades is driving development efforts to expand the use of this technology to airframe structures, automotive gears, medical devices, nuclear systems, and general industrial applications.  The laser peening process is described and factors important for successful applications are discussed.&#8221;</p>
<p>Two additional papers are planned to be presented.  One by Yunfeng Cao and Yung C. Shin of the Center for Laser-based Manufacturing at Purdue University entitled, &#8220;<strong>Predictive self-closed modeling of laser shock peening and parametric study</strong>,&#8221; another by Anoop Vasu1 and Ramana V. Grandhi2 of the Department of Mechanical and Materials Engineering at Wright State University entitled,<em> “</em><strong>Compressive Residual Stress Optimization in Laser Peening of a Curved Geometry</strong><strong>.”  </strong>Follow the links below to read the abstracts for these two papers.</p>
<p><strong><span style="text-decoration: underline;"><a href="http://www.google.com/url?sa=X&amp;q=http://www.shotpeening.org/ICSP-11/abstracts_detail.php%3FrecordID%3D067&amp;ct=ga&amp;cad=CAcQAhgAIAEoATAAOABA74Xz7wRIAVgAYgVlbi1VUw&amp;cd=-iuXUCpFvNY&amp;usg=AFQjCNE3dnYtrEXW7_kXrzaRyHTBSFJ40Q">Predictive self-closed modeling of laser shock peening</a></span></strong></p>
<p><strong><span style="text-decoration: underline;"><span style="text-decoration: underline;"><a href="http://www.google.com/url?sa=X&amp;q=http://www.shotpeening.org/ICSP-11/abstracts_detail.php%3FrecordID%3D105&amp;ct=ga&amp;cad=CAcQAhgAIAEoATAAOABAl5H07wRIAVgAYgVlbi1VUw&amp;cd=fpb2JhvPPAo&amp;usg=AFQjCNHLAlV1rSR_ab8Puj0BRS5cDhm5Yw">Compressive Residual Stress Optimization in Laser Peening of</a></span></span></strong></p>
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		<item>
		<title>DMC 2011</title>
		<link>http://lsptechnologies.com/dmc-2011/708/</link>
		<comments>http://lsptechnologies.com/dmc-2011/708/#comments</comments>
		<pubDate>Mon, 20 Jun 2011 23:31:58 +0000</pubDate>
		<dc:creator>Beth</dc:creator>
				<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Laser Peening Applications]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Trade Shows and Conferences]]></category>
		<category><![CDATA[David F Lahrman]]></category>
		<category><![CDATA[Fatigue Life]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=708</guid>
		<description><![CDATA[Laser peening also known as laser-peening or laser shock processing (LSP) increases the resistance of materials to surface-related failures such as, FOD, fatigue, fretting fatigue, and stress corrosion cracking.  It does this by driving compressive residual stresses into metals and alloys.  Please stop by our booth, David Lahrman will be available for discussion about the [...]]]></description>
			<content:encoded><![CDATA[<p></p><p><strong>Laser peening </strong>also known as laser-peening or laser shock processing (LSP) increases the resistance of materials to surface-related failures such as, FOD, fatigue, fretting fatigue, and stress corrosion cracking.  It does this by driving compressive residual stresses into metals and alloys. </p>
<p>Please stop by our booth, David Lahrman will be available for discussion about the benefits that laser peening surface enhancement technology can provide your parts to reduce their fatigue susceptibility.  See the beneifts of laser peening on our FAQs page at <a href="http://lsptechnologies.com/questions/">http://lsptechnologies.com/questions/</a>.</p>
<p>David Lahrman will also be available to discuss <strong>Laser Bond Inspection</strong>.  It is LSP Technologies&#8217; new NDE method to inspect adhesive bond joints in composites or other bonded materials.  LBI uses a localized stress wave created by a laser beam of high peak power with a short pulse to create an internal disbond in weak bonds that is detectable by the laser bond inspection system itself or by a post test ultrasonic inspection.</p>
<p><strong>LSP Technologies, Inc. will be exhibiting at DMC 2011. We hope you will visit us at booth number 628.</strong></p>
<p><em>November 28 &#8211; December 1, 2011<br />
Anaheim, California<br />
</em>Anaheim Convention Center<br />
Booth Number<strong>: 628</strong></p>
<p><a href="http://lsptechnologies.com/wp-content/uploads/2011/03/DMC-2011.jpg"><img class="alignnone size-medium wp-image-716" src="http://lsptechnologies.com/wp-content/uploads/2011/03/DMC-2011-300x67.jpg" alt="" width="300" height="67" /></a></p>
<p>The DMC is the flagship defense manufacturing technology forum for exchanging ideas, assessing technical project progress and dealing with the challenges of the many new and traditional defense industrial base issues across the services and agencies.</p>
<p><a href="http://www.dmc2011.com/">http://www.dmc2011.com/</a></p>
<p><strong> </strong></p>
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		<item>
		<title>Laser Bond Inspection</title>
		<link>http://lsptechnologies.com/laser-bond-inspection/817/</link>
		<comments>http://lsptechnologies.com/laser-bond-inspection/817/#comments</comments>
		<pubDate>Mon, 20 Jun 2011 22:53:10 +0000</pubDate>
		<dc:creator>Beth</dc:creator>
				<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[LBI Publications]]></category>
		<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[NDE]]></category>
		<category><![CDATA[Non-destructive Testing]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=817</guid>
		<description><![CDATA[LSP Technolgies is pioneering the field of using high energy lasers to non-destructively inspect adhesive bonds in composite and other bonded materials for weak or &#8220;kissing&#8221; bonds. The use of controlled, localized stress waves in materials and bonded joints offers new opportunities for the characterization of structures.  Bonded joints in particular benefit from this application because [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>LSP Technolgies is pioneering the field of using high energy lasers to non-destructively inspect adhesive bonds in composite and other bonded materials for weak or &#8220;kissing&#8221; bonds.</p>
<p>The use of controlled, localized stress waves in materials and bonded joints offers new opportunities for the characterization of structures.  Bonded joints in particular benefit from this application because there is no nondestructive inspection method to measure bond strength.  LSP Technologies&#8217; Laser Bond Inspection uses a high peak power short pulse laser to perform a localized proof test of a bond. The method can be nondestructively applied to strong bonds but will fail a weak bond, creating an internal disbond that is detectable by the laser bond inspection system itself or by post test ultrasonic inspection. </p>
<p>To date numerous tests have shown the method to be sensitive to weak bonds in carbon fiber reinforced polymer composites structure bonds created by poor adhesive mixing, improper surface preparation or contamination.</p>
<p>To Learn More  click on the link.</p>
<p><strong>Flash</strong><br />
<a title="http://mediazone.brighttalk.com/comm/ReedElsevier/33bdd84a70-22762-2251-24177" href="http://mediazone.brighttalk.com/comm/ReedElsevier/33bdd84a70-22762-2251-24177">http://mediazone.brighttalk.com/comm/ReedElsevier/33bdd84a70-22762-2251-24177</a></p>
<p><strong>Windows Media</strong><br />
<a title="http://mediazone.brighttalk.com/comm/ReedElsevier/b3a9cda1c2-22762-2250-24176" href="http://mediazone.brighttalk.com/comm/ReedElsevier/b3a9cda1c2-22762-2250-24176">http://mediazone.brighttalk.com/comm/ReedElsevier/b3a9cda1c2-22762-2250-24176</a></p>
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		<title>SAMPE 2011</title>
		<link>http://lsptechnologies.com/sampe-2011/779/</link>
		<comments>http://lsptechnologies.com/sampe-2011/779/#comments</comments>
		<pubDate>Thu, 16 Jun 2011 23:16:48 +0000</pubDate>
		<dc:creator>Beth</dc:creator>
				<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Trade Shows and Conferences]]></category>
		<category><![CDATA[Boeing]]></category>
		<category><![CDATA[David F Lahrman]]></category>
		<category><![CDATA[Fatigue Life]]></category>
		<category><![CDATA[LSP Technologies]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=779</guid>
		<description><![CDATA[SAMPE 2011 Society for the Advancement of Material and Processing  Engineering Long Beach Convention Center Dick Bossi of Boeing Research &#38; Technology; David Lahrman and David Sokol of LSP Technologies; and Craig Walters of Craig Walters and Associates were a co-presenters on the topic, &#8221; Laser Bond Inspection for Adhesive Bond Strength.&#8221; 2011- State of Industry:  Advanced Materials, Applications, [...]]]></description>
			<content:encoded><![CDATA[<p></p><p><strong>SAMPE 2011</strong><br />
Society for the Advancement of Material and Processing  Engineering<br />
Long Beach Convention Center</p>
<p>Dick Bossi of Boeing Research &amp; Technology; David Lahrman and David Sokol of LSP Technologies; and Craig Walters of Craig Walters and Associates were a co-presenters on the topic, &#8221; Laser Bond Inspection for Adhesive Bond Strength.&#8221;</p>
<p>2011- State of Industry:  Advanced Materials, Applications, and Processing Technology</p>
<p>The following is an excerpt from the SAMPE website.</p>
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<td width="357">&#8220;SAMPE partners with ASM International to bring SAMPE 2011 and AeroMat 2011 back to Long Beach, California. New exhibitors and new conference programs add value, while attendees can rely on traditional SAMPE offerings. As an added bonus, SAMPE conference attendees can attend AeroMat 2011 conference programs at no additional charge. The SAMPE Conference features a four-day technical program consisting of specialty classes and sessions.&#8221;</td>
<td width="189"> </td>
</tr>
</tbody>
</table>
<p>Visit the SAMPE website for other details: <a href="http://www.sampe.org/events/2011LongBeachCA.aspx">http://www.sampe.org/events/2011LongBeachCA.aspx</a></p>
]]></content:encoded>
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		<item>
		<title>LSP Technologies Presents at ALAW 2011</title>
		<link>http://lsptechnologies.com/lsp-technologies-presents-at-alaw-2011/846/</link>
		<comments>http://lsptechnologies.com/lsp-technologies-presents-at-alaw-2011/846/#comments</comments>
		<pubDate>Mon, 13 Jun 2011 23:35:09 +0000</pubDate>
		<dc:creator>SED</dc:creator>
				<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Laser Peening Applications]]></category>
		<category><![CDATA[Laser Peening Publications]]></category>
		<category><![CDATA[Shocking Waves]]></category>
		<category><![CDATA[Shot Peening Alternative]]></category>
		<category><![CDATA[Surface Enhancement Technologies]]></category>
		<category><![CDATA[Trade Shows and Conferences]]></category>
		<category><![CDATA[David F Lahrman]]></category>
		<category><![CDATA[Laser Generated Shock Waves]]></category>
		<category><![CDATA[Laser Shock Processing]]></category>
		<category><![CDATA[LSP]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[surface enhancement]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=846</guid>
		<description><![CDATA[LSP Technologies attended the Advanced Laser Applications Workshop held in Plymouth, Michigan May 3 through 5.  David Lahrman, Director of Business Development, presented a paper on &#8220;Laser Peening for Fatigue Improvement&#8221; on May 4th  at this year&#8217;s meeting.  This year&#8217;s theme was to adress the current economic and manufacturing challenges in the USA, including a new [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>LSP Technologies attended the Advanced Laser Applications</p>
<p>Workshop held in Plymouth, Michigan May 3 through 5. </p>
<p>David Lahrman, Director of Business Development, presented a</p>
<p>paper on &#8220;Laser Peening for Fatigue Improvement&#8221; on May 4th </p>
<p>at this year&#8217;s meeting.  This year&#8217;s theme was to adress the</p>
<p>current economic and manufacturing challenges in the USA,</p>
<p>including a new direction for the workshop, looking into</p>
<p>&#8220;What&#8217;s Going on Outside of Automotive?&#8221;</p>
]]></content:encoded>
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