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	<title>LSP Technologies &#187; LBI Technology</title>
	<atom:link href="http://lsptechnologies.com/category/laser_bond_inspection_technology/feed/" rel="self" type="application/rss+xml" />
	<link>http://lsptechnologies.com</link>
	<description>Making the world a safer place</description>
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		<title>Brochure</title>
		<link>http://lsptechnologies.com/brochure/591/</link>
		<comments>http://lsptechnologies.com/brochure/591/#comments</comments>
		<pubDate>Mon, 01 Aug 2011 13:48:18 +0000</pubDate>
		<dc:creator>Beth</dc:creator>
				<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Laser Peening Applications]]></category>
		<category><![CDATA[LBI Publications]]></category>
		<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Shot Peening Alternative]]></category>
		<category><![CDATA[Surface Enhancement Technologies]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=591</guid>
		<description><![CDATA[LSP Technologies offers affordable laser peening services to improve the fatigue properties of our customer&#8217;s military, aerospace, power generation, tube forming, or other types of parts.  We collaborate with our customers to enhance their products with this innovative laser technology by increasing reliability, improving safety, and adding value.  We also provide an innovative non-destructive method [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>LSP Technologies offers affordable laser peening services to improve the fatigue properties of our customer&#8217;s military, aerospace, power generation, tube forming, or other types of parts.  We collaborate with our customers to enhance their products with this innovative laser technology by increasing reliability, improving safety, and adding value.  We also provide an innovative non-destructive method of inspecting glue bonds in metals and/or composties that can detect &#8220;kissing bonds&#8221;. </p>
<p>For a better picture of our capabilities follow the link below to one of our marketing brochures.  </p>
<p><a href="http://lsptechnologies.com/wp-content/uploads/2010/05/LSP-Trifold.pdf">LSP Trifold</a></p>
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		<title>LSP Technologies Awarded Laser Bond Inspection Improvements Contract</title>
		<link>http://lsptechnologies.com/lsp-technologies-awarded-laser-bond-inspection-improvements-contract/954/</link>
		<comments>http://lsptechnologies.com/lsp-technologies-awarded-laser-bond-inspection-improvements-contract/954/#comments</comments>
		<pubDate>Mon, 01 Aug 2011 13:23:48 +0000</pubDate>
		<dc:creator>SED</dc:creator>
				<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[LSP Technologies]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=954</guid>
		<description><![CDATA[LSP Technologies’ proudly announces it has won a Task Order subcontracting award with Universal Technology Corporation (UTC) of Dayton, Ohio. UTC is the prime for the Air Force Research Laboratory’s Materials and Manufacturing Directorate, Manufacturing Technology Division (AFRL/RXM) contract for “Mobil Systems for Aircraft Structures”. This Task Order program supports LSP Technologies’ Laser Bond Inspection [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>LSP Technologies’ proudly announces it has won a Task Order subcontracting award with Universal Technology Corporation (UTC) of Dayton, Ohio. UTC is the prime for the Air Force Research Laboratory’s Materials and Manufacturing Directorate, Manufacturing Technology Division (AFRL/RXM) contract for “Mobil Systems for Aircraft Structures”.</p>
<p>This Task Order program supports LSP Technologies’ Laser Bond Inspection System for the inspection of bonded structures used in Aircraft structures. The objective of this MATES II T.O. program is to secure CDRH for the laser system and to develop additional capabilities for detecting defects in the bond line of bonded structures. The Laser Bond Inspection system will receive some improvements to ease customization for customers and make other updates and improvements. LSP Technologies will also conduct research under the contract to support the system growth. </p>
<p>Laser bond inspection technology (LBI) tests and verifies the strength of adhesively bonded joints used in composite structures within assemblies such as aircraft.  It is an inspection process that further assures the safety and reliability of those bonded structures. LBI technology is also being adapted for use with other bonded structures, including, for example, metals and ceramics, and metal to metal. It is an honor to be working with UTC on this important aspect for bridging the gap between military manufacturing needs and industry capabilities. For more information on LSP Technologies’ Laser Bond Inspection system and its capabilities, visit <a href="http://lsptechnologies.com/">http://lsptechnologies.com/</a>, or for more information about Universal Technology Corporation (UTC), visit <a href="http://www.utcdayton.com/">http://www.utcdayton.com/</a>.</p>
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		<title>Laser Bond Inspection</title>
		<link>http://lsptechnologies.com/laser-bond-inspection/817/</link>
		<comments>http://lsptechnologies.com/laser-bond-inspection/817/#comments</comments>
		<pubDate>Mon, 20 Jun 2011 22:53:10 +0000</pubDate>
		<dc:creator>Beth</dc:creator>
				<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[LBI Publications]]></category>
		<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[NDE]]></category>
		<category><![CDATA[Non-destructive Testing]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=817</guid>
		<description><![CDATA[LSP Technolgies is pioneering the field of using high energy lasers to non-destructively inspect adhesive bonds in composite and other bonded materials for weak or &#8220;kissing&#8221; bonds. The use of controlled, localized stress waves in materials and bonded joints offers new opportunities for the characterization of structures.  Bonded joints in particular benefit from this application because [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>LSP Technolgies is pioneering the field of using high energy lasers to non-destructively inspect adhesive bonds in composite and other bonded materials for weak or &#8220;kissing&#8221; bonds.</p>
<p>The use of controlled, localized stress waves in materials and bonded joints offers new opportunities for the characterization of structures.  Bonded joints in particular benefit from this application because there is no nondestructive inspection method to measure bond strength.  LSP Technologies&#8217; Laser Bond Inspection uses a high peak power short pulse laser to perform a localized proof test of a bond. The method can be nondestructively applied to strong bonds but will fail a weak bond, creating an internal disbond that is detectable by the laser bond inspection system itself or by post test ultrasonic inspection. </p>
<p>To date numerous tests have shown the method to be sensitive to weak bonds in carbon fiber reinforced polymer composites structure bonds created by poor adhesive mixing, improper surface preparation or contamination.</p>
<p>To Learn More  click on the link.</p>
<p><strong>Flash</strong><br />
<a title="http://mediazone.brighttalk.com/comm/ReedElsevier/33bdd84a70-22762-2251-24177" href="http://mediazone.brighttalk.com/comm/ReedElsevier/33bdd84a70-22762-2251-24177">http://mediazone.brighttalk.com/comm/ReedElsevier/33bdd84a70-22762-2251-24177</a></p>
<p><strong>Windows Media</strong><br />
<a title="http://mediazone.brighttalk.com/comm/ReedElsevier/b3a9cda1c2-22762-2250-24176" href="http://mediazone.brighttalk.com/comm/ReedElsevier/b3a9cda1c2-22762-2250-24176">http://mediazone.brighttalk.com/comm/ReedElsevier/b3a9cda1c2-22762-2250-24176</a></p>
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		<item>
		<title>Wright Dialogue with Industry</title>
		<link>http://lsptechnologies.com/wright-dialogue-with-industry/823/</link>
		<comments>http://lsptechnologies.com/wright-dialogue-with-industry/823/#comments</comments>
		<pubDate>Tue, 14 Jun 2011 13:34:53 +0000</pubDate>
		<dc:creator>Beth</dc:creator>
				<category><![CDATA[Laser Peening]]></category>
		<category><![CDATA[Laser Peening Applications]]></category>
		<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[Shot Peening Alternative]]></category>
		<category><![CDATA[Surface Enhancement Technologies]]></category>
		<category><![CDATA[bond inspection]]></category>
		<category><![CDATA[David F Lahrman]]></category>
		<category><![CDATA[Defense Manufacturing Conference]]></category>
		<category><![CDATA[Fatigue Life]]></category>
		<category><![CDATA[Foreign Object Damage]]></category>
		<category><![CDATA[Gas Turbine Engine]]></category>
		<category><![CDATA[High Energy Laser]]></category>
		<category><![CDATA[Laser Bond Inspection]]></category>
		<category><![CDATA[Laser Shock Processing]]></category>
		<category><![CDATA[laserpeening]]></category>
		<category><![CDATA[LSP]]></category>
		<category><![CDATA[NDE bond inspection]]></category>
		<category><![CDATA[surface enhancement]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=823</guid>
		<description><![CDATA[July 20-21, 2011 Hope Hotel &#38; Conference Center Wright-Patterson Air Force Base, Dayton, Ohio LSP Technologies is proud to attend again this year to discuss it&#8217;s laser peening process and services as well as it&#8217;s laser bond inspection process.  The following is taken from their website: The Dayton Area Defense Contractors Association (DaytonDefense) will sponsor [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>July 20-21, 2011<br />
Hope Hotel &amp; Conference Center<br />
Wright-Patterson Air Force Base, Dayton, Ohio</p>
<p>LSP Technologies is proud to attend again this year to discuss it&#8217;s laser peening process and services as well as it&#8217;s laser bond inspection process. </p>
<p>The following is taken from their website:<br />
The Dayton Area Defense Contractors Association (DaytonDefense) will sponsor the fifth &#8220;Wright Dialogue with Industry&#8221; conference on July 20-21, 2011 at the Hope Hotel and Conference Center, Wright-Patterson AFB, OH.</p>
<p>The purpose of this conference is to help promote economic development activity among local defense contractors and Wright-Patterson Air Force Base. Please plan to attend this year’s Wright Dialogue with Industry to hear first-hand from key leaders of the Air Force Research Laboratory (AFRL) organization as they discuss both current and future business opportunities.  There will be opportunities throughout the day for more detailed breakout sessions where you can pose your particular questions to the Laboratory representatives. Throughout the course of the event, there will be time to network and discuss opportunities to do business in greater detail with AFRL.</p>
<p><a href="http://www.wrightdialogue.org/pages/overview.html">http://www.wrightdialogue.org/pages/overview.html</a></p>
]]></content:encoded>
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		<item>
		<title>Mobile Laser Bond Inspection System Demonstraion</title>
		<link>http://lsptechnologies.com/mobile-laser-bond-inspection-system-demonstraion/394/</link>
		<comments>http://lsptechnologies.com/mobile-laser-bond-inspection-system-demonstraion/394/#comments</comments>
		<pubDate>Tue, 17 Nov 2009 00:32:09 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[Boeing]]></category>
		<category><![CDATA[David F Lahrman]]></category>
		<category><![CDATA[General Electric Aviation]]></category>
		<category><![CDATA[High Energy Laser]]></category>
		<category><![CDATA[Laser Bond Inspection]]></category>
		<category><![CDATA[Steven M Toller]]></category>
		<category><![CDATA[USAF]]></category>
		<category><![CDATA[WPAFB]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=394</guid>
		<description><![CDATA[On November 10, 2009 LSP Technologies successfully demonstrated to the USAF the mobile laser bond inspection system that was constructed on two USAF SBIR (small business innovative research) programs.  This advanced pulsed laser inspection system is configured in a self-contained, environmentally-controlled enclosure that sits on a mobile platform.  This advancement is essential for rapid insertion [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>On November 10, 2009 LSP Technologies successfully demonstrated to the USAF the mobile laser bond inspection system that was constructed on two USAF SBIR (small business innovative research) programs.  This advanced pulsed laser inspection system is configured in a self-contained, environmentally-controlled enclosure that sits on a mobile platform.  This advancement is essential for rapid insertion of the LBI process into aircraft manufacturing plant operations and aircraft maintenance depots.  There exists no equivalent laser system in the commercial sector.</p>
<p>Laser Bond Inspection (LBI) is a local proof-testing method that applies a well-controlled dynamic stress to a composite structure, and senses the failure of weak laminate or weak adhesive bonds in response to the stress. The dynamic stress is generated by the interaction of a pulsed laser beam with a composite structure. The controlled stressing of the composite material has no effect on the material or bond if it is not damaged, defective, or substandard. The technique offers a practical structural health monitoring solution for locating composite damage and defect regions in laminate and laminate-adhesive bonds in aircraft.</p>
<p>Benefits of laser bond inspection include the following: </p>
<ul>
<li>Allows the detection of “kissing bonds” in composite structures that are not detectable by standard nondestructive inspection techniques</li>
<li>Makes calibrated dynamic strength measurements to find weak areas in composite laminate or adhesive bonds that conventional testing cannot locate</li>
<li>LBI may be applied to metal-to-composite and metal-to-metal bonds as well as pure composite assemblies</li>
<li>LBI can be applied for inspecting a variety of commercial,  reconnaissance, and targeting aircraft</li>
<li>LBI improves reliability and reduce maintenance cost of composite aircraft structures</li>
</ul>
<p>As program manager of the project, David W Sokol would like to thank Steve Toller, Jim Niehaus, Brad Lance, Rick Mills, and Kevin Romer for all their hard work on the program.  He would also like to thank David Lahrman for working with WPAFB staff in making this USAF SBIR program possible.</p>
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		<title>2008 TechColumbus Innovation Awards</title>
		<link>http://lsptechnologies.com/2008-techcolumbus-innovation-awards/391/</link>
		<comments>http://lsptechnologies.com/2008-techcolumbus-innovation-awards/391/#comments</comments>
		<pubDate>Fri, 30 Jan 2009 02:52:33 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Commmunity Recognition]]></category>
		<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Laser Bond Inspection]]></category>
		<category><![CDATA[LBI]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=391</guid>
		<description><![CDATA[Finalists Announced for TechColumbus Innovation Awards On Thursday, February 5, 2009 the 2008 TechColumbus Innovation Awards will recognize outstanding achievements in technology leadership and innovation at the Greater Columbus Convention Center.  From a record number of entries from individuals and companies in all disciplines and industries, 13 winners will be honored and the region&#8217;s progress [...]]]></description>
			<content:encoded><![CDATA[<p></p><p style="text-align: center;"><strong><em>Finalists Announced for TechColumbus Innovation Awards</em></strong></p>
<p>On Thursday, February 5, 2009 the 2008 TechColumbus Innovation Awards will recognize outstanding achievements in technology leadership and innovation at the Greater Columbus Convention Center.  From a record number of entries from individuals and companies in all disciplines and industries, 13 winners will be honored and the region&#8217;s progress as an emerging tech center will be celebrated.</p>
<p>LSP Technologies is proud to announce we are a finalist in the Outstanding Service (company with less than 50 employees/more than 50) category and was nominated for our Laser Bond Inspection system and its ability to inspect the integrity of bonded composite structures, an ability that is unmatched by any other technology.  It is an honor to be a finalist for this award and recognized for our innovations. We look forward to the event to be surrounded by our peers, colleagues and mentors.</p>
<p>The TechColumbus Innovations Awards celebrate and honor individuals and teams in a variety of disciplines. Each category is an important component of the technology and innovation community. Receiving the top honor showcases an individual or team which is dramatically impacting Central Ohio and beyond.  For more information about TechColumbus and the Innovation Awards, visit <a href="http://www.techcolumbusinnovationawards.org/">http://www.techcolumbusinnovationawards.org</a>.</p>
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		<item>
		<title>Laser Bond Inspection Device for Composites: Has the Holy Grail Been Found?</title>
		<link>http://lsptechnologies.com/laser-bond-inspection-device-for-composites-has-the-holy-grail-been-found/29/</link>
		<comments>http://lsptechnologies.com/laser-bond-inspection-device-for-composites-has-the-holy-grail-been-found/29/#comments</comments>
		<pubDate>Sun, 12 Jun 2005 21:29:34 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[LBI Publications]]></category>
		<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[Adhesive Bond]]></category>
		<category><![CDATA[Boeing]]></category>
		<category><![CDATA[Kissing Bond]]></category>
		<category><![CDATA[Laser Bond Inspection]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=29</guid>
		<description><![CDATA[Originally published in NTIAC newsletter: Volume 30, No. 2, June 2005. Authored by Richard H Bossi, Kevin R Housen, and Craig T Walters SUMMARY Extensive experimental development, supported by 1-and 2-D hydrodynamic code simulations has demonstrated that the strength of bonds can be tested using calibrated weak shock waves (stress waves) generated at the surface of composite (and [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>Originally published in NTIAC newsletter: Volume 30, No. 2, June 2005.</p>
<p>Authored by Richard H Bossi, Kevin R Housen, and Craig T Walters</p>
<p>SUMMARY<br />
Extensive experimental development, supported by 1-and 2-D hydrodynamic code simulations has demonstrated that the strength of bonds can be tested using calibrated weak shock waves (stress waves) generated at the surface of composite (and other) joints. Previously full-scale roof testing of bonded structure has been the only sure method of detecting “kissing” or weak bonds. Laser bond inspection (LBI), using high-intensity stress waves, has been shown to provide a method for localized testing of bond strength.<br />
Controlled stress waves of sufficient intensity have been shown to be useful for adhesion evaluation. Gupta, et.al. demonstrated that internal bonds could be evaluated with shock waves [3-5]. Recently, high peak power, short burst laser systems have been shown to reliably and repeatedly test the strength of internal bondlines in composite joints of reasonable (6 to 15 mm total thickness) [6]. Modeling of the method has shown that the laser beam shape results in controlled, very localized testing of bond strength. A compact high peak power laser system and team delivery method has been designed for factory implementation. To date, numerous tests on composite to composite bonds have shown the method to be sensitive to weak bonds created by<br />
poor adhesive mixing, improper surface preparation and/or contamination.</p>
<p>To download the entire article- as a pdf: <a title="Laser Bond Inspection Device for Composites: Has the Holy Grail Been Found?" href="http://lsptechnologies.com/wp-content/uploads/2007/07/laser-bond-inspection-device-for-composites.pdf">Laser Bond Inspection Device for Composites: Has the Holy Grail Been Found?</a></p>
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