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	<title>LSP Technologies &#187; LBI Technology</title>
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		<title>Mobile Laser Bond Inspection System Demonstraion</title>
		<link>http://lsptechnologies.com/mobile-laser-bond-inspection-system-demonstraion/394/</link>
		<comments>http://lsptechnologies.com/mobile-laser-bond-inspection-system-demonstraion/394/#comments</comments>
		<pubDate>Tue, 17 Nov 2009 00:32:09 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[Boeing]]></category>
		<category><![CDATA[David F Lahrman]]></category>
		<category><![CDATA[General Electric Aviation]]></category>
		<category><![CDATA[High Energy Laser]]></category>
		<category><![CDATA[Laser Bond Inspection]]></category>
		<category><![CDATA[Steven M Toller]]></category>
		<category><![CDATA[USAF]]></category>
		<category><![CDATA[WPAFB]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=394</guid>
		<description><![CDATA[On November 10, 2009 LSP Technologies successfully demonstrated to the USAF the mobile laser bond inspection system that was constructed on two USAF SBIR (small business innovative research) programs.  This advanced pulsed laser inspection system is configured in a self-contained, environmentally-controlled enclosure that sits on a mobile platform.  This advancement is essential for rapid insertion [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>On November 10, 2009 LSP Technologies successfully demonstrated to the USAF the mobile laser bond inspection system that was constructed on two USAF SBIR (small business innovative research) programs.  This advanced pulsed laser inspection system is configured in a self-contained, environmentally-controlled enclosure that sits on a mobile platform.  This advancement is essential for rapid insertion of the LBI process into aircraft manufacturing plant operations and aircraft maintenance depots.  There exists no equivalent laser system in the commercial sector.</p>
<p>Laser Bond Inspection (LBI) is a local proof-testing method that applies a well-controlled dynamic stress to a composite structure, and senses the failure of weak laminate or weak adhesive bonds in response to the stress. The dynamic stress is generated by the interaction of a pulsed laser beam with a composite structure. The controlled stressing of the composite material has no effect on the material or bond if it is not damaged, defective, or substandard. The technique offers a practical structural health monitoring solution for locating composite damage and defect regions in laminate and laminate-adhesive bonds in aircraft.</p>
<p>Benefits of laser bond inspection include the following: </p>
<ul>
<li>Allows the detection of “kissing bonds” in composite structures that are not detectable by standard nondestructive inspection techniques</li>
<li>Makes calibrated dynamic strength measurements to find weak areas in composite laminate or adhesive bonds that conventional testing cannot locate</li>
<li>LBI may be applied to metal-to-composite and metal-to-metal bonds as well as pure composite assemblies</li>
<li>LBI can be applied for inspecting a variety of commercial,  reconnaissance, and targeting aircraft</li>
<li>LBI improves reliability and reduce maintenance cost of composite aircraft structures</li>
</ul>
<p>As program manager of the project, David W Sokol would like to thank Steve Toller, Jim Niehaus, Brad Lance, Rick Mills, and Kevin Romer for all their hard work on the program.  He would also like to thank David Lahrman for working with WPAFB staff in making this USAF SBIR program possible.</p>
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		<title>2008 TechColumbus Innovation Awards</title>
		<link>http://lsptechnologies.com/2008-techcolumbus-innovation-awards/391/</link>
		<comments>http://lsptechnologies.com/2008-techcolumbus-innovation-awards/391/#comments</comments>
		<pubDate>Fri, 30 Jan 2009 02:52:33 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Commmunity Recognition]]></category>
		<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[LSP Technologies]]></category>
		<category><![CDATA[Laser Bond Inspection]]></category>
		<category><![CDATA[LBI]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=391</guid>
		<description><![CDATA[Finalists Announced for TechColumbus Innovation Awards
On Thursday, February 5, 2009 the 2008 TechColumbus Innovation Awards will recognize outstanding achievements in technology leadership and innovation at the Greater Columbus Convention Center.  From a record number of entries from individuals and companies in all disciplines and industries, 13 winners will be honored and the region&#8217;s progress as [...]]]></description>
			<content:encoded><![CDATA[<p></p><p style="text-align: center;"><strong><em>Finalists Announced for TechColumbus Innovation Awards</em></strong></p>
<p>On Thursday, February 5, 2009 the 2008 TechColumbus Innovation Awards will recognize outstanding achievements in technology leadership and innovation at the Greater Columbus Convention Center.  From a record number of entries from individuals and companies in all disciplines and industries, 13 winners will be honored and the region&#8217;s progress as an emerging tech center will be celebrated.</p>
<p>LSP Technologies is proud to announce we are a finalist in the Outstanding Service (company with less than 50 employees/more than 50) category and was nominated for our Laser Bond Inspection system and its ability to inspect the integrity of bonded composite structures, an ability that is unmatched by any other technology.  It is an honor to be a finalist for this award and recognized for our innovations. We look forward to the event to be surrounded by our peers, colleagues and mentors.</p>
<p>The TechColumbus Innovations Awards celebrate and honor individuals and teams in a variety of disciplines. Each category is an important component of the technology and innovation community. Receiving the top honor showcases an individual or team which is dramatically impacting Central Ohio and beyond.  For more information about TechColumbus and the Innovation Awards, visit <a href="http://www.techcolumbusinnovationawards.org/">http://www.techcolumbusinnovationawards.org</a>.</p>
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		<title>Laser Bond Inspection Device for Composites: Has the Holy Grail Been Found?</title>
		<link>http://lsptechnologies.com/laser-bond-inspection-device-for-composites-has-the-holy-grail-been-found/29/</link>
		<comments>http://lsptechnologies.com/laser-bond-inspection-device-for-composites-has-the-holy-grail-been-found/29/#comments</comments>
		<pubDate>Sun, 12 Jun 2005 21:29:34 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[LBI Publications]]></category>
		<category><![CDATA[LBI Technology]]></category>
		<category><![CDATA[Adhesive Bond]]></category>
		<category><![CDATA[Boeing]]></category>
		<category><![CDATA[Kissing Bond]]></category>
		<category><![CDATA[Laser Bond Inspection]]></category>

		<guid isPermaLink="false">http://lsptechnologies.com/?p=29</guid>
		<description><![CDATA[Originally published in NTIAC newsletter: Volume 30, No. 2, June 2005.
Authored by Richard H Bossi, Kevin R Housen, and Craig T Walters
SUMMARY
Extensive experimental development, supported by 1-and 2-D hydrodynamic code simulations has demonstrated that the strength of bonds can be tested using calibrated weak shock waves (stress waves) generated at the surface of composite (and other) joints. Previously [...]]]></description>
			<content:encoded><![CDATA[<p></p><p>Originally published in NTIAC newsletter: Volume 30, No. 2, June 2005.</p>
<p>Authored by Richard H Bossi, Kevin R Housen, and Craig T Walters</p>
<p>SUMMARY<br />
Extensive experimental development, supported by 1-and 2-D hydrodynamic code simulations has demonstrated that the strength of bonds can be tested using calibrated weak shock waves (stress waves) generated at the surface of composite (and other) joints. Previously full-scale roof testing of bonded structure has been the only sure method of detecting “kissing” or weak bonds. Laser bond inspection (LBI), using high-intensity stress waves, has been shown to provide a method for localized testing of bond strength.<br />
Controlled stress waves of sufficient intensity have been shown to be useful for adhesion evaluation. Gupta, et.al. demonstrated that internal bonds could be evaluated with shock waves [3-5]. Recently, high peak power, short burst laser systems have been shown to reliably and repeatedly test the strength of internal bondlines in composite joints of reasonable (6 to 15 mm total thickness) [6]. Modeling of the method has shown that the laser beam shape results in controlled, very localized testing of bond strength. A compact high peak power laser system and team delivery method has been designed for factory implementation. To date, numerous tests on composite to composite bonds have shown the method to be sensitive to weak bonds created by<br />
poor adhesive mixing, improper surface preparation and/or contamination.</p>
<p>To download the entire article- as a pdf: <a title="Laser Bond Inspection Device for Composites: Has the Holy Grail Been Found?" href="http://lsptechnologies.com/wp-content/uploads/2007/07/laser-bond-inspection-device-for-composites.pdf">Laser Bond Inspection Device for Composites: Has the Holy Grail Been Found?</a></p>
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