Finalists Announced for TechColumbus Innovation Awards
On Thursday, February 5, 2009 the 2008 TechColumbus Innovation Awards will recognize outstanding achievements in technology leadership and innovation at the Greater Columbus Convention Center. From a record number of entries from individuals and companies in all disciplines and industries, 13 winners will be honored and the region’s progress as an emerging tech center will be celebrated.
LSP Technologies is proud to announce we are a finalist in the Outstanding Service (company with less than 50 employees/more than 50) category and was nominated for our Laser Bond Inspection system and its ability to inspect the integrity of bonded composite structures, an ability that is unmatched by any other technology. It is an honor to be a finalist for this award and recognized for our innovations. We look forward to the event to be surrounded by our peers, colleagues and mentors.
The TechColumbus Innovations Awards celebrate and honor individuals and teams in a variety of disciplines. Each category is an important component of the technology and innovation community. Receiving the top honor showcases an individual or team which is dramatically impacting Central Ohio and beyond. For more information about TechColumbus and the Innovation Awards, visit http://www.techcolumbusinnovationawards.org.